Silane Coupling Agent and Modified Epoxy Resin/coating
Aug 22, 2023
Silane coupling agent is a type of small molecule organic silicon compound with organic functional groups and 2-3 SiORs.It has good compatibility with epoxy resin and is easy to achieve homogeneous reaction between the two.Silane coupling agents can chemically bond (couple) with organic and inorganic materials through Si-OR, bonding multiple inorganic materials into organic resin coatings, thereby enhancing the reinforcement effect of the resin and improving the mechanical properties of the organic resin coating.
Graphene (GE) was modified with silane coupling agent KH-570 to improve the surface reactivity of graphene. Then, the modified GE was compounded with bisphenol A epoxy resin by solution blending to obtain a GE/epoxy resin composite material.Research has found that with the increase of the amount of silane KH-570 modified GE, the thermal stability, bending strength, elastic modulus, and impact strength of the modified epoxy resin material are significantly improved.
KH-550 modified epoxy resin coating is prepared by the ring opening reaction of active amino N-H bonds in aminosilane such as KH-550 with epoxy groups in epoxy resin. The results showed that KH-550 was soluble with epoxy resin, and after reaction, the two could achieve covalent bonding. The introduction of KH-550 in the curing system could reduce the internal stress of the system. When m (EP): m (KH-550)=10:1 in the curing system and reacted at 40 ℃ for 3 hours, the cured coating performance of the modified epoxy material is the best.
A series of amino silicone oil polymer coupling agents were prepared using silane coupling agent KH-560 and side chain diamine amino silicone oil (AEAPS) as raw materials, and used as modifiers to synergistically modify epoxy resin (EP) coatings with 4,4 '- diaminodiphenylmethane (DDM).The results showed that when the mass ratio of EP to APCA-60 (the mass ratio of the side chain terminal amino group of AEAPS to the epoxy group of the coupling agent in APCA-60 was 100:60) was 10:1, the tensile strength, impact strength, and elongation at break of the modified epoxy resin coating were increased by 59.55%, 94.55%, and 94.37% compared to the unmodified epoxy resin coating, respectively, and the Tg of the modified EP/APCA-60 system could reach a maximum of 161.56 ℃, The toughness and heat resistance have been effectively improved.
POSS modified epoxy resin/coating
Caged polyhedral oligomeric silsesquioxanes (POSS) are extremely small nanohybrids that are connected to organic groups at the top corners of hexahedra, making POSS compatible with organic materials and due to its small molecular size（ φ Only 1-3 nm), the core - (SiO3/2) n - is similar to SiO2, has high hardness and is not easy to burn. It also has a large Si-O bond energy (422.5 kJ/mol), good thermal stability, and strong light transmittance. Physical or chemical modification of epoxy resin with POSS can not only achieve uniform mutual solubility between POSS and epoxy resin, but also effectively improve the heat stability, aging resistance, and flexibility of the resin coating without affecting the coating adhesion.
With the increasing variety of POSS and lower synthesis costs, its use in modifying resins is gradually becoming more mature. However, there are also some shortcomings in using POSS to modify epoxy resins. The main problem is that excessive addition of POSS can cause system "agglomeration". If the problem of "agglomeration" of high filling POSS can be solved in the future, its application in modified thermosetting resins has broad prospects.At present, octaepoxide based POSS (such as hybrid plastic EP0409) is widely used in the modification of epoxy resins. Due to the large number of epoxy groups (8) contained in the molecule, this POSS is prone to decrease in the mechanical properties of epoxy coatings due to excessive crosslinking when used in epoxy coating systems. Therefore, it is generally advisable to control its mass fraction between 1% and 5% when modifying epoxy resins, If POSS with 2-3 epoxy groups is used, it is expected to increase its filling capacity and solve the above problems.
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